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Advancing Semiconductor Innovation Across Materials Engineering and Manufacturing
Increasing AI workloads are driving explosive compute demand, pushing the semiconductor industry to meet unprecedented performance targets while addressing thermal and power challenges through system-level engineering breakthroughs.
As AI workloads increase, explosive compute demand is pushing the semiconductor industry to meet unprecedented performance targets. Even small delays can have outsized financial impact in fast-moving AI hardware cycles. Simultaneously, the shift from chip-level optimization to system-level engineering is compounding thermal and power challenges. Meeting these demands requires breakthroughs in materials engineering and manufacturing processes to sustain the rapid pace of AI hardware innovation.